rev.1.00, apr.25.2003, page 1 of 5 HVL397CM variable capacitance diode for vco rej03g0014-0100z rev.1.00 apr.25.2003 features ? high capacitance ratio. (n = 2.9 min) ? thin extremely small flat package (tefp) is suitable for surface mount design. ordering information type no. laser mark package code HVL397CM a tefp pin arrangement cathode mark mark 1. cathode 2. anode 1 2 a
HVL397CM rev.1.00, apr.25.2003, page 2 of 5 absolute maximum ratings (ta = 25 c) item symbol value unit reverse voltage v r 15 v junction temperature tj 125 c storage temperature tstg ? 55 to +125 c electrical characteristics (ta = 25 c) item symbol min typ max unit test condition i r1 ?? 10 v r = 10 v reverse current i r2 ?? 50 na v r = 10 v, ta = 60 c c 1 27.0 ? 28.5 v r = 1 v, f = 1 mhz c 2 18.0 ? 20.0 v r = 2 v, f = 1 mhz capacitance c 4 6.80 ? 8.50 pf v r = 4 v, f = 1 mhz n 1 1.3 ??? c 1 / c 2 capacitance ratio n 2 2.9 ??? c 1 / c 4 series resistance r s ?? 1.2 ? v r = 1 v, f = 470 mhz notes : 1. please do not use the soldering iron due to avoid high stress to the tefp package. 2. the material of lead is exposed for cutting plane. therefore, soldering nature of lead tip part is considered as unquestioned. please kindly consider soldering nature.
HVL397CM rev.1.00, apr.25.2003, page 3 of 5 main characteristic 01620 4812 1 5 60 50 40 20 10 30 0 1.0 0.6 0.4 0 1.0 5.0 0.5 0.7 0.8 0.9 f = 470mhz 0 series resistance r s ( ? ) 10 ?13 10 ?12 10 ?11 10 ?10 2.0 3.0 4.0 reverse voltage v r (v) fig.1 reverse current vs. reverse voltage reverse voltage v r (v) fig.3 series resistance vs. reverse voltage reverse current i r (a) 10 ? 9 fig.2 capacitance vs. reverse voltage reverse voltage v r (v) capacitance c (pf) f = 1mhz 23 4 0.1 1.0 10 ? 1.5 ? 1.0 ? 0.5 0 ? 2.0 reverse voltage v r (v) fig.4 linearity factor vs. reverse voltage l f = ? (logc)/ ? (logv r )
HVL397CM rev.1.00, apr.25.2003, page 4 of 5 package dimensions package code jedec jeita mass (reference value) tefp ? ? 0.0006 g 0.8 1.0 0.05 0.3 0.05 0.6 0.05 0.4 max 0.13 0.05 as of january, 2003 unit: mm + 0.10 ? 0.05
HVL397CM rev.1.00, apr.25.2003, page 5 of 5 keep safety first in your circuit designs! 1. renesas technology corporation puts the maximum effort into making semiconductor products better and more reliable, but ther e is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corporation p roduct best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas technology corporat ion or a third party. 2. renesas technology corporation assumes no responsibility for any damage, or infringement of any third-party's rights, origin ating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corporation without notice due to product improvements or other reas ons. it is therefore recommended that customers contact renesas technology corporation or an authorized renesas technology corporation product distributor for the latest produ ct information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracie s or errors. please also pay attention to information published by renesas technology corporation by various means, including the renesas te chnology corporation semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp oration assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corporation semiconductors are not designed or manufactured for use in a device or system that is used un der circumstances in which human life is potentially at stake. please contact renesas technology corporation or an authorized renesas technology corporation product distributor wh en considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or u ndersea repeater use. 6. the prior written approval of renesas technology corporation is necessary to reprint or reproduce in whole or in part these materials. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is pro hibited. 8. please contact renesas technology corporation for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com copyright ? 2003. renesas technology corporation, all rights reserved. printed in japan. colophon 0.0
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